Date

2027/02/17  ~  2027/02/19
291Last
Day

  • Location

    Asia/ Japan/ Tokyo

  • Contact Person

    Blythe Chuang

  • Website

Engineering, Manufacturing & Processing, Smart Manufacturing | Machine Tools, Metalworking, Automation | Semiconductor, Electronics, Electrical Engineering | Web 3.0, Telecommunications

IC & Sensor Packaging Expo 2027

Asia’s Leading Event for IC Final Manufacturing gathering Advanced Equipment, Materials and Services

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About the Show, Floor Plan, Report on Previous Show, Exhibitors at Previous Show, Participation Fees, Subsidies, and more