Date

2027/02/17  ~  2027/02/19
382Last
Day
  • Location

    Asia/ Japan/ Tokyo

  • Contact Person

    Grace Tsai

Engineering, Manufacturing & Processing, Smart Manufacturing | Machine Tools, Metalworking, Automation | Semiconductor, Electronics, Electrical Engineering | Web 3.0, Telecommunications

IC & Sensor Packaging Expo 2027

Asia’s Leading Event for IC Final Manufacturing gathering Advanced Equipment, Materials and Services

2024

2024年日本國際IC封裝及測試專業展覽會[1月]

參展廠商家數 1,688
參觀買主 77,744